LDMOS transistor and method for manufacturing the same

ABSTRACT

An LDMOS transistor can include: a field oxide layer structure adjacent to a drain region; and at least one drain oxide layer structure adjacent to the field oxide layer structure along a lateral direction, where a thickness of the drain oxide layer structure is less than a thickness of the field oxide layer, and at least one of a length of the field oxide layer structure and a length of the drain oxide layer structure is adjusted to improve a breakdown voltage performance of the LDMOS transistor.

RELATED APPLICATIONS

This application claims the benefit of Chinese Patent Application No.201810531384.8, filed on May 29, 2018, which is incorporated herein byreference in its entirety.

FIELD OF THE INVENTION

The present invention generally relates to semiconductor devices, andmore particularly to laterally diffused metal oxide semiconductordevices and associated methods.

BACKGROUND

Voltage regulators, such as DC-to-DC voltage converters, are used toprovide stable voltage sources for various electronic systems. EfficientDC-to-DC converters are particularly useful for battery management inlow power devices (e.g., laptop notebooks, cellular phones, etc.). Aswitching voltage regulator can generate an output voltage by convertingan input DC voltage into a high frequency voltage, and then filteringthe high frequency input voltage to generate the output DC voltage. Forexample, the switching regulator can include a switch for alternatelycoupling and decoupling an input DC voltage source (e.g., a battery) toa load (e.g., an integrated circuit [IC], a light-emitting diode [LED],etc.). An output filter, can include an inductor and a capacitor, andmay be coupled between the input voltage source and the load to filterthe output of the switch, and thus provide the output DC voltage. Acontroller (e.g., a pulse-width modulator, a pulse frequency modulator,etc.) can control the switch to maintain a substantially constant outputDC voltage. Lateral double-diffused metal oxide semiconductor (LDMOS)transistors may be utilized in switching regulators due to theirperformance in terms of a tradeoff between their specific on-resistance(R_(dson)) and drain-to-source breakdown voltage (BV_(d_s)).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a first example LDMOS transistor, inaccordance with embodiments of the present invention.

FIG. 2 is a cross-sectional view of a second example LDMOS transistor,in accordance with embodiments of the present invention.

FIG. 3 is a cross-sectional view of a third example LDMOS transistor, inaccordance with embodiments of the present invention.

FIG. 4A-4J are cross-sectional views showing stages of manufacturing thethird example LDMOS transistor, in accordance with embodiments of thepresent invention.

DETAILED DESCRIPTION

Reference may now be made in detail to particular embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. While the invention may be described in conjunction with thepreferred embodiments, it may be understood that they are not intendedto limit the invention to these embodiments. On the contrary, theinvention is intended to cover alternatives, modifications andequivalents that may be included within the spirit and scope of theinvention as defined by the appended claims. Furthermore, in thefollowing detailed description of the present invention, numerousspecific details are set forth in order to provide a thoroughunderstanding of the present invention. However, it may be readilyapparent to one skilled in the art that the present invention may bepracticed without these specific details. In other instances, well-knownmethods, procedures, processes, components, structures, and circuitshave not been described in detail so as not to unnecessarily obscureaspects of the present invention.

Semiconductor devices are generally manufactured using two complexmanufacturing processes: front-end manufacturing and back-endmanufacturing. Front-end manufacturing may involve the formation of aplurality of die on the surface of a semiconductor wafer. Each die onthe wafer may contain active and passive electrical components, whichare electrically connected to form functional electrical circuits.Active electrical components, such as transistors and diodes, have theability to control the flow of electrical current. Passive electricalcomponents, such as capacitors, inductors, resistors, and transformers,create a relationship between voltage and current necessary to performelectrical circuit functions.

Passive and active components can be formed over the surface of thesemiconductor wafer by a series of process steps including doping,deposition, photolithography, etching, and planarization. Dopingintroduces impurities into the semiconductor material by techniques suchas ion implantation or thermal diffusion. The doping process modifiesthe electrical conductivity of semiconductor material in active devices,transforming the semiconductor material into an insulator, conductor, ordynamically changing the semiconductor material conductivity in responseto an electric field or base current. Transistors contain regions ofvarying types and degrees of doping arranged as necessary to enable thetransistor to promote or restrict the flow of electrical current uponthe application of the electric field or base current.

Active and passive components are formed by layers of materials withdifferent electrical properties. The layers can be formed by a varietyof deposition techniques determined in part by the type of materialbeing deposited. For example, thin film deposition may involve chemicalvapor deposition (CVD), physical vapor deposition (PVD), electrolyticplating, and electroless plating processes. Each layer is generallypatterned to form portions of active components, passive components, orelectrical connections between components.

The layers can be patterned using photolithography, which involves thedeposition of light sensitive material, e.g., photoresist, over thelayer to be patterned. A pattern is transferred from a photomask to thephotoresist using light. The portion of the photoresist patternsubjected to light is removed using a solvent, exposing portions of theunderlying layer to be patterned. The remainder of the photoresist maybe removed, leaving behind a patterned layer. Alternatively, some typesof materials can be patterned by directly depositing the material intothe areas or voids formed by a previous deposition/etch process usingtechniques such as electroless and electrolytic plating.

Depositing a thin film of material over an existing pattern canexaggerate the underlying pattern and create a non-uniformly flatsurface. A uniformly flat surface may be used to produce smaller andmore densely packed active and passive components. Planarization can beused to remove material from the surface of the wafer and produce auniformly flat surface. Planarization can involve polishing the surfaceof the wafer with a polishing pad. An abrasive material and corrosivechemical are added to the surface of the wafer during polishing. Thecombined mechanical action of the abrasive and corrosive action of thechemical removes any irregular topography, resulting in a uniformly flatsurface.

Back-end manufacturing refers to cutting or singulating the finishedwafer into the individual die and then packaging the die for structuralsupport and environmental isolation. To singulate the die, the wafer isscored and broken along non-functional regions of the wafer called sawstreets or scribes. The wafer may be singulated using a laser cuttingtool or saw blade. After singulation, the individual die are mounted toa package substrate that includes pins or contact pads forinterconnection with other system components. Contact pads formed overthe semiconductor die can then be connected to contact pads within thepackage. The electrical connections can be made with solder bumps, studbumps, conductive paste, or wire bonds, as a few examples. Anencapsulant or other molding material may be deposited over the packageto provide physical support and electrical isolation. The finishedpackage can then be inserted into an electrical system and thefunctionality of the semiconductor device is made available to the othersystem components.

In one embodiment, a laterally diffused metal oxide semiconductor(LDMOS) transistor can include: (i) a field oxide layer structureadjacent to a drain region; and (ii) at least one drain oxide layerstructure adjacent to the field oxide layer structure along a lateraldirection, where a thickness of the drain oxide layer structure is lessthan a thickness of the field oxide layer, and at least one of a lengthof the field oxide layer structure and a length of the drain oxide layerstructure is adjusted to improve a breakdown voltage performance of theLDMOS transistor.

Referring now to FIG. 1, shown is a cross-sectional view of a firstexample LDMOS transistor, in accordance with embodiments of the presentinvention. In this particular example, an n-type LDMOS is shown, and a“first” doping type is a p-type, and a “second” doping type is ann-type. The LDMOS transistor can include a base layer, p-type wellregion 105, n-type drift region 103, n-type source region 107, p-typebody contact region 108, and n-type drain region 106. For example,p-type well region 105 may be located in the source region of the baselayer, n-type drift region 103 can be located in the drain region of thebase layer, n-type source region 107 and a p-type body contact region108 may be located in p-type well region 105, and n-type drain region106 may be located in n-type drift region 103. The LDMOS transistor canalso include field oxide layer structure 104 located on an upper surfaceof the base layer and adjacent to the drain region, and at least onedrain oxide layer structure 120 located on an upper surface of the baselayer and adjacent to the field oxide layer structure in the lateraldirection. For example, the thickness of drain oxide layer structure 120may be less than the thickness of field oxide layer structure 104.

When the number of the drain oxide layer structures is greater than 1,the thickness of drain oxide layer structures 120 may gradually decreasealong a direction from the drain region to a channel region of the LDMOStransistor. In this particular example, field oxide layer structure 104and drain oxide layer structure 120 may be formed by a thermal oxidationprocess or a local oxidation of silicon (LOCOS) process. Drain oxidelayer structure 120 can include drain oxide layer structures 1201 and1202. Drain oxide layer structure 1201 may be adjacent to field oxidelayer structure 104 and have a thickness that is less than that of fieldoxide layer structure 104. Drain oxide layer structure 1202 may berelatively close to the channel region and adjacent to drain oxide layerstructure 1201. The thickness of drain oxide layer structure 1202 may beless than that of drain oxide layer structure 1201, such that drainoxide layer structure 120 is formed in a stepped structure, and itsthickness gradually decreases along a direction from the drain region tothe channel region. Drain region 106, source region 107, and bodycontact region 108 can be electrically connected to drain electrodeDrain, source electrode Source, and body electrode Body, respectively(shown in FIG. 1 as connection terminals).

The LDMOS transistor can also include gate conductor 110 that fullycovers the thinnest drain oxide layer structure and at least partiallycovers the drain oxide layer structure adjacent to the thinnest drainoxide layer structure. For example, gate conductor 110 may extend atleast to the surface of drain oxide layer structure 1201. Gate conductor110 can be electrically connected to the gate electrode Gate (shown inFIG. 1 as a connection terminal). The LDMOS transistor can also includegate dielectric layer 109 located under gate conductor 110, and adjacentto drain oxide layer structure 120. For example, gate dielectric layer109 may be adjacent to drain oxide layer structure 1202. The breakdownvoltage of the device can be increased by changing the length of thegate conductor on the oxide layer. Further, the longer the length of thegate conductor on the oxide layer extends toward the drain regiondirection, the higher the breakdown voltage of the device, where theoxide layer includes the drain oxide layer structure and the field oxidelayer.

The base layer may include only p-type substrate 101, or the base layermay include p-type substrate 101 and n-type deep well region 102 locatedin substrate 101. In this particular example, p-type well region 105 andn-type drift region 103 may both be located in n-type deep well region102. As compared to a single thick field oxide layer structure in anLDMOS transistor, this particular example may include at least one drainoxide layer structure adjacent to the field oxide layer, and thethickness of drain oxide layer structure may be thinner than that of thefield oxide layer structure. Also, the thickness of the drain oxidelayer structure may gradually decrease along a direction from the drainregion to the channel region. The thinner oxide layer can alleviate thebird's beak effect of the device, and improve the hot carrier effect andreliability of the device. In addition, the thickest field oxide layerstructure can withstand higher voltages, and the gradually decreasingthickness of drain oxide layer structure can make the distribution ofthe electric field more uniform, thereby improving the breakdown voltageperformance of the device. The breakdown voltage performance of theLDMOS transistor may also be improved by adjusting the length ratio ofthe field oxide layer structure and the drain oxide layer structure.

When the length of drain oxide layer structure 120 is longer, or thethickness of drain oxide layer structure 120 is thinner, the hot carriereffect of the device may be improved, and the on-resistance (Rdson) ofdevice is smaller, but the breakdown voltage (BV) of the transistor canalso be decreased, and vice versa. The electric field of the device maybe distributed more uniformly by adjusting the length ratio of eachdrain oxide layer structure. Therefore, the bird's beak effect may bealleviated mainly by adjusting the length ratio of the field oxide layerstructure and the drain oxide layer structure in case the BV of thetransistor reaches the requirements. In this way, the BV and Rdson ofthe transistor may have a better compromise given the trade-off, and thereliability of the hot carrier effect may be greatly improved. In thisexample, the drain oxide layer structure is a LOCOS, and those skilledin the art will recognize that a device structure having a drain oxidelayer structure formed via shallow trench isolation (STI) or othersuitable forms may also be utilized in certain embodiments.

Referring now to FIG. 2, shown is a cross-sectional view of a secondexample LDMOS transistor, in accordance with embodiments of the presentinvention. In this particular example, a junction depth of the driftregion may decrease in the direction from the drain region to thechannel region, and the doping concentration of the drift region maydecrease in the direction from the drain region to the channel region,to improve the on-resistance performance of the LDMOS transistor. Driftregion 203 can be formed by three regions of different junction depthsand different doping concentrations. In the direction from the drainregion to the channel region, the three regions are sequentially driftregion 2031, drift region 2032, and drift region 2033. For example, thejunction depth of drift region 2032 may be less than that of driftregion 2031, and greater than that of drift region 2033. The dopingconcentration of drift region 2032 may be less than that of drift region2031 and greater than that of drift region 2033.

In particular embodiments, the drift region with a gradually decreasingjunction depth may be adopted to correspond to the drain oxide layerstructure with gradually decreasing thickness. In this approach, theelectric field distribution of the drain region is more uniform and nolonger concentrated at a certain angle of the drift region. Thus, thebreakdown voltage of the transistor may be further improved, thebreakdown voltage and the on-resistance of the transistor have a bettercompromise given the trade-off, and the reliability of the transistormay be improved. In this example, drift region 203 may be formed bythree regions. However, those skilled in the art will recognize that thenumber of drift regions may be reduced or increased 2 according to theparticular transistor requirements (e.g., 2 breakdown voltage,on-resistance, etc.), such that the breakdown voltage and theon-resistance of the transistor have a better compromise or balance.

Referring now to FIG. 3, shown is a cross-sectional view of a thirdexample LDMOS transistor, in accordance with embodiments of the presentinvention. In this particular example, the p-type well region is acomposite well region. For example, the composite well region closer todrain region may have a first convex region in the lateral direction,and the composite well region toward the bottom of the base layer mayhave a second convex region in the vertical direction. Composite wellregion 305 may be formed by superposing well regions 3052 and 3051. Forexample, a width of well region 3051 may be greater than a width of wellregion 3052, a junction depth of well region 3052 may be greater thanthat of well region 3051, and a doping concentration of well region 3052may be less than a doping concentration of well region 3051. Well region3051 can be used to adjust a threshold voltage of the transistor. Thewidth of well region 3052 may be less than the width of well region 3051to form a channel region on the surface of the base layer. The dopingconcentration of well region 3052 may be less than or equal to thedoping concentration of well region 3051 in order to reduce its effecton the threshold voltage. Well region 3052 may utilize its depth toincrease the area through which the channel current flows to increasethe bulk resistance the transistor. In this way the safe operatingregion of the device, and the breakdown voltage of the transistor, maybe increased.

Referring now to FIG. 4A-4J, shown are cross-sectional views showingstages of manufacturing the third example LDMOS transistor, inaccordance with embodiments of the present invention. In this particularexample, a field oxide layer structure can be formed adjacent to a drainregion on an upper surface of a base layer. In addition, at least onedrain oxide layer structure can be formed adjacent to the field oxidelayer structure on the upper surface of the base layer along the lateraldirection, where the thickness of the drain oxide layer structure isless than the thickness of the field oxide layer. In FIG. 4A, p-typesubstrate 201 may be provided, and deep well region 202 can be formed byimplanting an n-type impurity into substrate 201.

Subsequently, as shown in FIGS. 4B-4E, field oxide layer structure 2041and drain oxide layer structure can be sequentially grown along adirection from the drain region to the channel region on the surface ofthe drain region of deep well region 202 by a thermal oxidation processor LOCOS process. In particular embodiments, the number of the drainoxide layer structures is two: drain oxide layer structures 2042 and2043. Further, a thickness of field oxide layer structure 2041, athickness of drain oxide layer structure 2042, and a thickness of drainoxide layer structure 2043 may be sequentially decreased by controllingtemperature, time, pressure, and other parameters of the thermaloxidation process. Further, between forming field oxide layer structure2041 and forming drain oxide layer structure 2042, a p-type impurity maybe implanted in a source region of the LDMOS transistor to form wellregion 2052. For example, the breakdown voltage performance of the LDMOStransistor can be improved by adjusting the length ratio of the fieldoxide layer structure and the drain oxide layer structure. Subsequently,an n-type drift region may be formed in the drain region of the baselayer. For example, a junction depth of the drift region may graduallydecrease in the direction from the drain region to the channel region,in order to increase the on-resistance performance of the LDMOStransistor.

In FIG. 4F, drift regions 2031, 2032, and 2033 may sequentially beformed along the direction from the drain region to the channel region,such as by an ion implantation process. A doping concentration of driftregion 2031, a doping concentration of drift region 2032, and a dopingconcentration of drift region 2033 may sequentially decrease. Also, ajunction depth of drift region 2031, a junction depth of drift region2032, and a junction depth of drift region 2033 may also be sequentiallydecreased by controlling the energy of the ion implantation.

In FIGS. 4G-4H, an oxide layer may be formed by a thermal oxidationprocess in regions where the surface of deep well region 202 is notcovered by the field oxide layer structure and the drain oxide layerstructure. In addition, the oxide layer may be partially etched to formgate dielectric layer 209. In FIG. 4H, gate conductor 210 can be formedon dielectric layer 209 and a portion of the drain oxide layerstructure. For example, along the lateral direction, the gate conductormay fully cover the thinnest drain oxide layer structure, and at leastpartially cover the drain oxide layer structure adjacent to the thinnestdrain oxide layer structure. For example, gate conductor 210 can extendat least to the surface of drain oxide layer structure 2042.

In FIG. 4I, p-type impurity may be implanted in the source region toform well region 2051 such that well region 2051 partially overlaps withwell region 2052. For example, a width of well region 2051 may begreater than that of well region 2052, and a junction depth of wellregion 2052 may be greater than that of well region 2051. Also, wellregions 2051 and 2052 may be superposed to form a composite well region.The composite well region closer to the drain region may have a firstconvex region along the lateral direction, and the composite well regiontoward the bottom of the base layer may have a second convex regionalong the vertical direction. Finally, as shown in FIG. 4J, drain region206 can be formed in the drift region, and source region 207 and bodycontact region 208 may be formed in the composite well region.

In particular embodiments, an LDMOS transistor can include a field oxidelayer structure adjacent to a drain region, and at least one drain oxidelayer structure adjacent to the field oxide layer structure along alateral direction. A thickness of the drain oxide layer structure may beless than that of the field oxide layer. When the number of the drainoxide layer structures is greater than 1, the thickness of the drainoxide layer structure can gradually decrease along a direction from adrain region to a channel region of the LDMOS transistor. The LDMOStransistor may also include a drift region of a second doping typelocated in the drain region, and a composite well region located in asource region of the LDMOS transistor. In addition, a junction depth ofthe drift region may gradually decrease along a direction from the drainregion to the channel region of the LDMOS transistor. In particularembodiments, the drain oxide layer structure with gradually decreasingthickness can relieve the bird's beak effect, improve the hot carriereffect, and improve the reliability and breakdown voltage of thetransistor. Also, the drift region with decreasing junction depth canachieve a better compromise/balance between the breakdown voltage andthe on-resistance, and the safe operating region of the transistor mayaccordingly be improved.

The embodiments were chosen and described in order to best explain theprinciples of the invention and its practical applications, to therebyenable others skilled in the art to best utilize the invention andvarious embodiments with modifications as are suited to particularuse(s) contemplated. It is intended that the scope of the invention bedefined by the claims appended hereto and their equivalents.

What is claimed is:
 1. A laterally diffused metal oxide semiconductor(LDMOS) transistor, comprising: a) a field oxide layer structureadjacent to a drain electrode region on an upper surface of a baselayer; b) at least one drain oxide layer structure adjacent to the fieldoxide layer structure only along a lateral direction on the uppersurface of the base layer, wherein each of the at least one drain oxidelayer structure and the field oxide layer structure comprises an oxide;and c) wherein a thickness of the drain oxide layer structure is lessthan a thickness of the field oxide layer, and adjustments of at leastone of a length of the field oxide layer structure and a length of thedrain oxide layer structure change a breakdown voltage performance ofthe LDMOS transistor.
 2. The LDMOS transistor according to claim 1,further comprising a drift region located in a drain region and having asecond doping type, wherein the drain oxide layer and the field oxidelayer are located in the drift region.
 3. The LDMOS transistor accordingto claim 1, further comprising a composite well region located in asource region and having a first doping type, wherein the composite wellregion close to the drain electrode region comprises a first convexregion in the lateral direction, and the composite well region towardthe bottom of the base layer comprises a second convex region in avertical direction.
 4. The LDMOS transistor according to claim 2,wherein a doping concentration of the drift region gradually decreasesalong the direction from the drain region to the channel region.
 5. TheLDMOS transistor according to claim 3, wherein the composite well regionis formed by superposing a first well region and a second well region, awidth of the second well region is greater than a width of the firstwell region, and a junction depth of the first well region is greaterthan a junction depth of the second well region.
 6. The LDMOS transistoraccording to claim 5, wherein a doping concentration of the first wellregion is less than a doping concentration of the second well region. 7.The LDMOS transistor according to claim 1, wherein when the number ofthe drain oxide layer structures is greater than 1, the thickness of thedrain oxide layer structures gradually decreases along the directionfrom the drain region to the channel region.
 8. The LDMOS transistoraccording to claim 7, further comprising a gate conductor that fullycovers the thinnest drain oxide layer structure and at least partiallycovers the drain oxide layer structure adjacent to the thinnest drainoxide layer structure.
 9. The LDMOS transistor according to claim 8,further comprising a gate dielectric layer located under the gateconductor and adjacent to the drain oxide layer structure.
 10. The LDMOStransistor according to claim 1, further comprising a source electroderegion having a second doping type and a body contact region having afirst doping type located in a well region of a source region, whereinthe drain electrode region has a second doping type and is located inthe drift region.
 11. The LDMOS transistor according to claim 1, whereinthe length ratio of the field oxide layer structure to the drain oxidelayer structure is adjusted to change the breakdown voltage performanceof the LDMOS transistor and an on-resistance performance.
 12. The LDMOStransistor according to claim 7, wherein the length ratio of each drainoxide layer structure is adjusted to change the breakdown voltageperformance of the LDMOS transistor.
 13. The LDMOS transistor accordingto claim 2, wherein a junction depth of the drift region graduallydecreases in a direction from the drain region to a channel region. 14.The LDMOS transistor according to claim 1, wherein each of the at leastone drain oxide layer structure and the field oxide layer structure isformed by an oxidation process.
 15. The LDMOS transistor according toclaim 1, wherein each of the at least one drain oxide layer structureand the field oxide layer structure is centered about the upper surfaceof the base layer.